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 Dual LDO with Low Noise, High Performance and Low IQ
ISL78302
ISL78302 is a high performance dual LDO capable of sourcing 300mA current from each output. It has a low standby current and is stable with output capacitance of 1F to 10F with ESR of up to 200m. The device integrates an individual Power-On-Reset (POR) function for each output. The POR delay for VO2 can be externally programmed by connecting a timing capacitor to the CPOR pin. The POR delay for VO1 is internally fixed at approximately 2ms. A reference bypass pin is also provided for connecting a noise filtering capacitor for low noise and high-PSRR applications. The quiescent current is typically only 47A with both LDOs enabled and active. Separate enable pins control each individual LDO output. When both enable pins are low, the device is in shutdown, typically drawing less than 0.5A. The part operates down to 2.3V and up to 6.5V input. The typical output voltage can be as low as 1.2V and as high as 3.3V for each regulator. Please refer to the ordering information section for standard options. Other voltage selections are available upon request. The ISL78302 is both AEC - Q100 rated and fully TS16949 compliant. The ISL78302 is rated for the automotive temperature range (-40C to +105C).
Features
* Integrates Two 300mA High Performance LDOs * Excellent Transient Response to Large Current Steps * 1.8% Accuracy Over All Operating Conditions * Excellent Load Regulation: < 0.1% Voltage Change Across Full Range of Load Current * Extremely Low Quiescent Current: 47A (Both LDOs Active) * Wide Input Voltage Capability: 2.3V to 6.5V * Low Dropout Voltage: Typically 300mV @ 300mA * Low Output Noise: Typically 37VRMS @ 100A (1.5V) * Stable with 1F to 10F Ceramic Capacitors * Separate Enable and POR Pins for Each LDO * Soft-start and Staged Turn-on to Limit Input Current Surge During Enable * Current Limit and Over-temperature Protection * Tiny 10 Lead 3mm x 3mm DFN Package * TS16949 Compliant * AEC - Q100 Tested * Pb-free (RoHS Compliant)
Applications
* Radio Receivers * Camera Modules * GPS/Navigation * Infotainment Systems
Typical Application
ISL78302 VIN (2.3 TO 6.5V) 1 ON 2 3 4 5 C1 C2 C3 VIN EN1 EN2 CBYP CPOR VO1 VO2 POR2 POR1 GND 10 9 8 7 6 C4 C5 VOUT2 OK VOUT2 TOO LOW VOUT1 OK VOUT1 TOO LOW VOUT1 VOUT2 RESET2 (200ms DELAY, C3 = 0.01F) RESET1 (2ms DELAY) ENABLE1 OFF ON ENABLE2 OFF
C1, C4, C5: 1F X5R CERAMIC CAPACITOR C2: 0.01F X7R CERAMIC CAPACITOR C3: 0.01F X7R CERAMIC CAPACITOR
January 28, 2011 FN7696.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners.
ISL78302 Block Diagram
VIN
VO1 VO2 LDO ERROR AMPLIFIER
VO1
~1.0V VREF TRIM POR COMPARATOR 1V VOK1 POR1 LDO-2 QEN1 QEN2 VOK2 POR2
VO2
IS1 LDO-1
QEN1
IS1
IS2
VO1 100k
EN1 EN2 CBYP UVLO
CONTROL LOGIC
POR2 VOK2 POR2 DELAY
100k
BANDGAP AND TEMPERATURE SENSOR
VO2
VOLTAGE REFERENCE GENERATOR
1.00V 0.94V 0.90V
VOK1
POR1 DELAY
POR1
CPOR
GND
Pin Configuration
ISL78302 (10 LD 3X3 DFN) TOP VIEW
VIN 1 EN1 2 EN2 3 CBYP 4 CPOR 5 10 VO1 9 8 7 6 VO2 POR2 POR1 GND
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ISL78302 Pin Descriptions
PIN NUMBER 1 2 3 4 5 PIN NAME VIN EN1 EN2 CBYP CPOR Analog I/O Low Voltage Compatible CMOS Input Low Voltage Compatible CMOS Input Analog I/O Analog I/O TYPE DESCRIPTION Supply Voltage/LDO Input. Connect a 1F capacitor to GND. LDO-1 Enable. ENABLE = HIGH LDO-2 Enable. ENABLE = HIGH Reference Bypass Capacitor Pin. Recommended to connect capacitor of value 0.01F between this pin and GND for optimum noise and PSRR performance. POR2 Delay Setting Capacitor Pin. Connect a capacitor between this pin and GND to delay the POR2 output release after LDO-2 output reaches 94% of its specified voltage level. (200ms delay per 0.01F). GND is the connection to system ground. Connect to PCB Ground plane. Open-drain POR Output for LDO-1 (active-low). Internally connected to VO1 through 100k resistor. Open-drain POR Output for LDO-2 (active-low). Internally connected to VO2 through 100k resistor. LDO-2 Output. Connect capacitor of value 1F to 10F to GND (1F recommended). LDO-1 Output. Connect capacitor of value 1F to 10F to GND (1F recommended).
6 7 8 9 10
GND POR1 POR2 VO2 VO1
Ground Open Drain Output (1mA) Open Drain Output (1mA) Analog I/O Analog I/O
Ordering Information
PART NUMBER (Notes 1, 3, 4) ISL78302ARFBZ Coming Soon ISL78302ARBFZ Coming Soon ISL78302ARNBZ Coming Soon ISL78302ARBNZ Coming Soon ISL78302ARNWZ Coming Soon ISL78302ARWCZ Coming Soon ISL78302ARFWZ Coming Soon ISL78302ARCWZ NOTES: 1. Add "-T*"suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. For other output voltages, contact Intersil. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), please see device information page for ISL78302. For more information on MSL please see techbrief TB363. PART MARKING DNAB DNAC DNAD DNAE DNAF DNAG DNAH DANJ VO1 VOLTAGE (V) (Note 2) 2.5 1.5 3.3 1.5 3.3 1.2 2.5 1.8 VO2 VOLTAGE (V) (Note 2) 1.5 2.5 1.5 3.3 1.2 1.8 1.2 1.2 TEMP RANGE (C) -40 to +105 -40 to +105 -40 to +105 -40 to +105 -40 to +105 -40 to +105 -40 to +105 -40 to +105 PACKAGE (Pb-Free) 10 Ld 3x3 DFN 10 Ld 3x3 DFN 10 Ld 3x3 DFN 10 Ld 3x3 DFN 10 Ld 3x3 DFN 10 Ld 3x3 DFN 10 Ld 3x3 DFN 10 Ld 3x3 DFN PKG DWG. # L10.3x3C L10.3x3C L10.3x3C L10.3x3C L10.3x3C L10.3x3C L10.3x3C L10.3x3C
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FN7696.0 January 28, 2011
ISL78302
Absolute Maximum Ratings
Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7.1V VO1, VO2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6V All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (VIN + 0.3)V
Thermal Information
Thermal Resistance (Notes 5, 6) JA (C/W) JC (C/W) 10 Ld 3x3 DFN Package . . . . . . . . . . . . . . . 59 18.5 Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-40C to +125C Operating Temperature Range . . . . . . . . . . . . . . . . . . . . .-40C to +105C Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65C to +150C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
ESD Ratings
Human Body Model (Tested per JESD22-A114E) . . . . . . . . . . . . . . . . . . 3kV Machine Model (Tested per JESD-A115-A) . . . . . . . . . . . . . . . . . . . . . 200V Charge Device Model (Tested per JESD22-C101C). . . . . . . . . . . . . . . . . 2kV
Recommended Operating Conditions
Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . .-40C to +105C Supply Voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3V to 6.5V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 6. For JC, the "case temp" location is the center of the exposed metal pad on the package underside.
Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40C to +105C; VIN = (VO + 0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1F; CO = 1F; CBYP = 0.01F; CPOR = 0.01F. Boldface limits apply over the operating temperature range, -40C to +105C.
PARAMETER SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS
DC CHARACTERISTICS
Supply Voltage Ground Current IDD1 IDD2 Shutdown Current UVLO Threshold IDDS VUV+ VUVRegulation Voltage Accuracy VIN = VO + 0.5V to 5.5V, IO = 10A to 300mA, TJ = +25C VIN = VO + 0.5V to 5.5V, IO = 10A to 300mA, TJ = -40C to +125C Maximum Output Current Internal Current Limit Dropout Voltage (Note 7) IMAX ILIM VDO IO = 300mA IO = 150mA Thermal Shutdown Temperature TSD+ TSDContinuous 1.9 1.6 -0.8 -1.8 300 320 475 300 150 145 110 250 650 VIN Quiescent condition: IO1 = 0A; IO2 = 0A One LDO active Both LDO active 30 47 0.3 2.1 1.8 36 55 2.1 2.3 2.0 +0.8 +1.8 A A A V V % % mA mA mV mV 2.3 6.5 V
C C
AC CHARACTERISTICS
Ripple Rejection IO = 10mA, VIN = 2.8V(min), VO = 1.5V, CBYP = 0.01F @ 1kHz @ 10kHz @ 100kHz 64 51 38 dB dB dB
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FN7696.0 January 28, 2011
ISL78302
Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: TA = -40C to +105C; VIN = (VO + 0.5V) to 6.5V with a minimum VIN of 2.3V; CIN = 1F; CO = 1F; CBYP = 0.01F; CPOR = 0.01F. Boldface limits apply over the operating temperature range, -40C to +105C. (Continued)
PARAMETER Output Noise Voltage SYMBOL TEST CONDITIONS IO = 100A, VO = 1.5V, TA = +25C, CBYP = 0.01F BW = 10Hz to 100kHz MIN (Note 8) TYP 37 MAX (Note 8) UNITS VRMS
DEVICE START-UP CHARACTERISTICS
Device Enable Time LDO Soft-Start Ramp Rate EN1, EN2 PIN CHARACTERISTICS Input Low Voltage Input High Voltage Input Leakage Current Pin Capacitance VIL VIH IIL, IIH CPIN Informative 5 -0.3 1.35 0.5 VIN + 0.3 0.1 V V A pF tEN tSSR Time from assertion of the ENx pin to when the output voltage reaches 95% of the VO(nom) Slope of linear portion of LDO output voltage ramp during start-up 250 30 500 60 s s/V
POR1, POR2 PIN CHARACTERISTICS
POR1, POR2 Thresholds VPOR+ VPORPOR1 Delay tP1LH tP1HL POR2 Delay tP2LH tP2HL POR1, POR2 Pin Output Low Voltage POR1, POR2 Pin Internal Pull-Up Resistance NOTES: 7. VOx = 0.98*VOx(NOM); Valid for VOx greater than 1.85V. 8. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. VOL RPOR @ IOL = 1.0mA 78 100 CPOR = 0.01F 100 As a percentage of nominal output voltage 91 87 0.5 94 90 2.0 25 200 25 0.2 180 300 97 93 3.2 % % ms s ms s V k
EN1 EN2 tEN VPOR+ VPORVPOR+ VPOR-
FIGURE 1. TIMING PARAMETER DEFINITION
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FN7696.0 January 28, 2011
ISL78302 Typical Performance Curves
0.4 VO = 2.5V +25C -40C +105C OUTPUT VOLTAGE CHANGE (%) 0.3 OUTPUT VOLTAGE, VO (%) 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 ILOAD = 0mA 0.20 0.15 0.10 0.05 0 -0.05 -0.10 -0.15 -0.20 0 50 100 150 200 250 300 350 400 +25C -40C +105C VIN = 3.3V VO = 2.5V
INPUT VOLTAGE (V)
LOAD CURRENT - IO (mA)
FIGURE 2. LINE REGULATION (2.5V OUTPUT)
FIGURE 3. LOAD REGULATION
0.10 0.08 OUTPUT VOLTAGE CHANGE (%) 0.06 0.04 0.02 0 -0.02 -0.04 -0.06 -0.08 -0.10 -40 -25 -10 5 20 35 50 65 80 95 110 VIN = 3.3V VO = 1.5V VIN = 3.3V VO = 2.5V
2.6 2.4 OUTPUT VOLTAGE, VO (V) 2.2 2.0 1.8 1.6 1.4 1.5 VO = 2.5V
IO = 0mA IO = 150mA IO = 300mA
VO = 1.5V IO = 0mA IO = 150mA IO = 300 mA
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
TEMPERATURE (C)
INPUT VOLTAGE (V)
FIGURE 4. OUTPUT VOLTAGE CHANGE vs TEMPERATURE
FIGURE 5. OUTPUT VOLTAGE vs INPUT VOLTAGE (2.5V and 1.5V OUTPUT)
400 350 300 250 200 150 100 50 0 0 50 100 150 200 250 300 350 400 VO = 1.5V +25C -40C GROUND CURRENT (A) +105C
55 54 53 52 51 50 49 48 47 46 45 2.5 3.0 3.5 4.0 VO1 = 2.5V VO2= 1.5V IO (BOTH CHANNELS) = 0A 4.5 5.0 5.5 6.0 6.5 +25C -40C +105C
DROPOUT VOLTAGE, VDO (mV)
OUTPUT LOAD (mA)
INPUT VOLTAGE (V)
FIGURE 6. DROPOUT VOLTAGE vs LOAD CURRENT
FIGURE 7. GROUND CURRENT vs INPUT VOLTAGE
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FN7696.0 January 28, 2011
ISL78302 Typical Performance Curves
200 VIN = 3.5V 180 GROUND CURRENT (A) 160 140 120 100 80 60 +25C 40 0 50 100 150 200 250 LOAD CURRENT (mA) 300 350 400 40 -40 -25 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 110 -40C VO1= 2.5V GROUND CURRENT (A) VO2= 1.5V +105C 55
(Continued)
60 VIN = 3.6V VO1= 2.5V VO2= 1.5V ILOAD = 0A BOTH OUTPUTS ON 50
45
FIGURE 8. GROUND CURRENT vs LOAD
FIGURE 9. GROUND CURRENT vs TEMPERATURE
VO1 = 2.5V VO2 = 1.5V IL1 = 300mA VIN IL2 = 300mA VO1 VO1 VO2
VO1 = 2.5V VO2 = 1.5V IL1 = 300mA POR1 IL2 = 300mA CPOR = 0.01F
POR2
V02
FIGURE 10. POWER-UP/POWER-DOWN
FIGURE 11. POWER-UP/POWER-DOWN WITH POR SIGNALS
VO2 (10mV/DIV)
VO (50mV/DIV)
VO1 = 2.5V VO2 = 1.5V IL1, IL2 = 300mA CBYP = 0.01uF CL1, CL2 = 1F ILOAD
VIN = 3.5V VO = 1.5V
FIGURE 12. TURN-ON/TURN-OFF RESPONSE
FIGURE 13. LOAD TRANSIENT RESPONSE
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FN7696.0 January 28, 2011
ISL78302 Typical Performance Curves
100 90 80 70 PSRR (dB) 60 50 40 30 20 10 0 10 100 1k 10k 100k 1M SPECTRAL NOISE DENSITY (mV/Hz) VIN = 3.3V VOUT = 1.5V IO = 10mA CLOAD = 1F CBYP = 0.01F
(Continued)
10 VIN = 3.6V VOUT = 2.5V ILOAD = 10mA 1 CIN = 1F CLOAD = 1F CBYP = 0.01F
0.1
0.01 10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
FIGURE 14. PSRR vs FREQUENCY
FIGURE 15. SPECTRAL NOISE DENSITY vs FREQUENCY (2.5V OUTPUT, 10mA LOAD)
10 SPECTRAL NOISE DENSITY (mV/Hz) VOUT = 2.5V ILOAD = 300mA 1 CIN = 1F CLOAD = 1F CBYP = 0.01F SPECTRAL NOISE DENSITY (mV/Hz) VIN = 3.6V
10 VIN = 3.6V VOUT = 1.5V ILOAD = 10mA 1 CIN = 1F CLOAD = 1F CBYP = 0.01F
0.1
0.1
0.01 10
100
1k
10k
100k
1M
0.01 10
100
FREQUENCY (Hz)
1k 10k FREQUENCY (Hz)
100k
1M
FIGURE 16. SPECTRAL NOISE DENSITY vs FREQUENCY (2.5V OUTPUT, 300mA LOAD)
FIGURE 17. SPECTRAL NOISE DENSITY vs FREQUENCY (1.5V OUTPUT, 10mA LOAD)
10 SPECTRAL NOISE DENSITY (mV/Hz) VIN = 3.6V VOUT = 1.5V ILOAD = 300mA 1 CIN = 1F COUT = 1F CBYP = 0.01F
0.1
0.01 10
100
1k
10k
100k
1M
FREQUENCY (Hz)
FIGURE 18. SPECTRAL NOISE DENSITY vs FREQUENCY (1.5V OUTPUT, 300mA LOAD)
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FN7696.0 January 28, 2011
ISL78302 Functional Description
The ISL78302 contains two high performance LDOs. High performance is achieved through a circuit that delivers fast transient response to varying load conditions. In a quiescent condition, the ISL78302 adjusts its biasing to achieve the lowest standby current consumption. The device also integrates current limit protection, smart thermal shutdown protection, staged turn-on and soft-start. Smart thermal shutdown protects the device against overheating. Staged turn-on and soft-start minimize start-up input current surges without causing excessive device turn-on time. The bandgap generates a zero temperature coefficient (TC) voltage for the reference divider. The reference divider provides the regulation reference, POR detection thresholds, and other voltage references required for current generation and over-temperature detection. The current generator provides the references required for adaptive biasing as well as references for LDO output current limit and thermal shutdown determination.
LDO Regulation and Programmable Output Divider
The LDO regulator is implemented with a high-gain operational amplifier driving a PMOS pass transistor. The design of the ISL78302 provides a regulator that has low quiescent current, fast transient response, and overall stability across all operating and load current conditions. LDO stability is guaranteed for a 1F to 10F output capacitor that has a tolerance better than 20% and an ESR less than 200m. The design is performance-optimized for a 1F capacitor. Unless limited by the application, use of an output capacitor value above 4.7F is not normally needed, as LDO performance improvement is minimal. Each LDO uses an independently trimmed 1V reference. An internal resistor divider drops the LDO output voltage down to 1V. This is compared to the 1V reference for regulation. The resistor division ratio is programmed in the factory to the output voltages of 1.2V, 1.5V, 1.8V, 2.5V and 3.3V.
Power Control
The ISL78302 has two separate enable pins (EN1 and EN2) to individually control power to each of the LDO outputs. When both EN1 and EN2 are low, the device is in shutdown mode. During this condition, all on-chip circuits are off, and the device draws minimum current, typically less than 0.5A. When one or both of the enable pins is asserted, the device first polls the output of the UVLO detector to ensure that VIN voltage is at least about 2.1V. Once verified, the device initiates a start-up sequence. During the start-up sequence, trim settings are first read and latched. Then, sequentially, the bandgap, reference voltage and current generation circuitry power-up. Once the references are stable, a fast-start circuit quickly charges the external reference bypass capacitor (connected to the CBYP pin) to the proper operating voltage. After the bypass capacitor has been charged, the LDOs power-up in their specified sequence. Soft-start circuitry integrated into each LDO limits the initial ramp-up rate to about 30s/V to minimize current surge. If EN1 is brought high and EN2 goes high before the VO1 output stabilizes, the ISL78302 delays the VO2 turn-on until the VO1 output reaches its target level. If EN2 is brought high and EN1 goes high before VO2 starts its output ramp, then VO1 turns on first and, the ISL78302 delays the VO2 turn-on until the VO1 output reaches its target level. If EN2 is brought high and EN1 goes high after VO2 starts its output ramp, then the ISL78302 immediately starts to ramp up the VO1 output. If both EN1 and EN2 are brought high at the same time, the VO1 output has priority and is always powered up first. During operation, whenever the VIN voltage drops below 1.8V, the ISL78302 immediately disables both LDO outputs. When VIN rises back above 2.1V, the device re-initiates its start-up sequence, and LDO operation will resume automatically.
Power-On Reset Generation
Each LDO has a separate Power-on Reset signal generation circuit, which outputs to the respective POR pins. The POR signal is generated as follows. A POR comparator continuously monitors the output of each LDO. The LDO enters a power-good state when the output voltage is above 94% of the expected output voltage for a period exceeding the LDO PGOOD entry delay time. In the power-good state, the open-drain PORx output is in a high-impedance state. An internal 100k pull-up resistor pulls the pin up to the respective LDO output voltage. An external resistor can be added between the PORx output and the LDO output for a faster rise time; however, the PORx output should not connect through an external resistor to a supply greater than the associated LDO voltage. The power-good state is exited when the LDO output falls below 90% of the expected output voltage for a period longer than the PGOOD exit delay time. While power-good is false, the ISL78302 pulls the respective POR pin low. For LDO-1, the PGOOD entry delay time is fixed at about 2ms, while the PGOOD exit delay is about 25s. For LDO-2, the PGOOD entry and exit delays are determined by the value of the external capacitor connected to the CPOR pin. For a 0.01F capacitor, the entry and exit delays are 200ms and 25s, respectively. Larger or smaller capacitor values will yield proportionately longer or shorter delay times. The POR exit delay should never be allowed to be less than 10s to ensure sufficient immunity against transient induced false POR triggering.
Reference Generation
The reference generation circuitry includes a trimmed bandgap, a trimmed voltage reference divider, a trimmed current reference generator, and an RC noise filter. The filter includes the external capacitor connected to the CBYP pin. A 0.01F (capacitor connected CBYP) implements a 100Hz lowpass filter and is recommended for most high-performance applications. Capacitor values above 0.01F are not recommended for the CBYP pin. 9
FN7696.0 January 28, 2011
ISL78302
Over-Temperature Detection
The bandgap provides a proportional-to-temperature current that indicates the temperature of the silicon. This current is compared with references to determine whether the device is in danger of damage from overheating. When the die temperature reaches about +145C, one or both of the LDOs momentarily shuts down until the die cools sufficiently. In the overheat condition, only the LDO sourcing more than 50mA is shut off. This shutoff does not affect the operation of the other LDO. If both LDOs source more than 50mA and an overheat condition occurs, both LDO outputs are disabled. Once the die temperature falls back below about +110C and disabled LDOs are re-enabled, the soft-start automatically takes place. The ISL78302 provides short-circuit protection by limiting the output current to about 475mA. If short circuited, an output current of 475mA causes die heating. If the short circuit lasts long enough, the overheat detection circuit turns off the output.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision.
DATE 1/28/11 REVISION FN7696.0 Initial Release. CHANGE
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL78302 To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff FITs are available from our website at: http://rel.intersil.com/reports/sear
For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com
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FN7696.0 January 28, 2011
ISL78302
Package Outline Drawing
L10.3x3C
10 LEAD DUAL FLAT PACKAGE (DFN) Rev 2, 09/09
3.00 A B 10 6 PIN 1 INDEX AREA 1 2 3.00 2.38 0.50 6 PIN #1 INDEX AREA
10 x 0.25 6 (4X) 0.10 C B
1.64
TOP VIEW
BOTTOM VIEW (4X)
10x 0.40 5 0.10 M C B
PACKAGE OUTLINE (10x 0.25)
(10 x 0.60)
SEE DETAIL "X" 0.10 C 0.90 MAX BASE PLANE C
2.38
0.20 SIDE VIEW
SEATING PLANE 0.08 C
(8x 0.50)
1.64 TYPICAL RECOMMENDED LAND PATTERN C 0.20 REF 0.05 DETAIL "X" NOTES: 1. 2. 3. 4. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. Unless otherwise specified, tolerance : Decimal 0.05 Dimension b applies to the metallized terminal and is measured between 0.18mm and 0.30mm from the terminal tip. 5. 6. Tiebar shown (if present) is a non-functional feature. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be 5
either a mold or mark feature. 7. COMPLAINT TO JEDEC MO-229-WEED-3 except for E-PAD dimensions.
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FN7696.0 January 28, 2011


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